MUTI WAVE
Semiconductor Ultrasound Technology — a precision-engineered system for multi-depth skin interaction, from core chip to daily ritual.
Semiconductor Ultrasound Technology — a precision-engineered system for multi-depth skin interaction, from core chip to daily ritual.
Deliver precise stimulation across multiple skin depth layers through beam convergence. Direct energy delivery to support the skin's foundation appearance.
Focused vertical delivery with lateral wide diffusion. Optimized micro-massage for an enhanced facial look.
Precise targeting at deeper layers through beam convergence. Enhanced energy concentration at focal points.
Multi-depth precise-energy design for human interaction via Sequential, Lateral, and Cross beam-forming.
Independent multi-depth beam forming control enables precise energy delivery at multiple depth levels.
Calibrated energy output for each depth level ensures precise interaction while maintaining comfort to surrounding skin areas.
Gentle multi-layer stimulation to enhance facial contours.
Structured firming motion along neck & shoulder lines.
Wide-area stimulation for body & shoulder care.
Users reported a gradual and repeatable improvement in overall comfort and daily experience throughout the 4-week routine.
Designed to support a consistent, professional-grade self-care routine beyond conventional beauty rollers.
Comfortable daily use with no reported harsh skin reactions during the observation period.
MUTI WAVE integrates advanced semiconductor ultrasound technology and timeless design principles into a single precision-engineered system, delivering professional-grade standards for your daily routine.
Most at-home devices suffer from unstable energy delivery, risking inconsistent results. MUTI WAVE is different. Embedded the MAX 14808 chipset — the same high performance semiconductor architecture used in industrial-grade ultrasound engineering. It delivers millions of steady micro-pulses per second with zero fluctuation, ensuring energy targets the skin's foundation with absolute precision.
This represents only the raw cost of our central chips — excluding our advanced thermal architecture, premium assembly, and 17 years of dedicated R&D.
Water-circulated Heat Pipe & Heat Spreader: Advanced liquid-cooled thermal stabilization.
Active Airflow Cooling: High-end engineering for continuous performance.
Safety Standard: Maintained under 45°C stabilized handle temperature for ultimate comfort and skin safety.
(06301) 서울특별시 강남구 논현로 28길 25,
한국과학기술원 도곡 캠퍼스 304호
미래창조과학부 국책 과제 연구단 CISS: 부설 연구소 기업
ciss.re.kr/companies/view/id/55
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